this is information on a product in full production. march 2014 docid17306 rev 2 1/9 stps40100hr aerospace 2 x 20 a - 100 v schottky rectifier datasheet - production data features ? forward current: 2 x 20 a ? repetitive peak voltage: 100 v ? low forward voltage drop: 0.9 v ? maximum junction temperature: 175 c ? negligible switching losses ? low capacitance ? high reverse avalanche surge capability ? hermetic packages ? target radiation qualification: ? 150 krad (si) low dose rate ? 1 mrad high dose rate ? escc qualified description this power schottky rectifier is designed and packaged to comply with the escc5000 specification for aerospace products. housed in hermetically sealed packages both surface mount and through hole, it is ideal for use in applications for aerospace and other harsh environments. the stps40100hr is intended for use in medium voltage application and particularly, in high frequency circuits where low switching losses and low noise are required. to-254 table 1. device summary order code escc detailed specification quality level package i f (av) v rrm t j (max) v f (max) stps40100c2fy1 - engineering model to-254 2 x 20 100 175 0.9 STPS40100C2FYT 5106/019/01 escc flight www.st.com
characteristics stps40100hr 2/9 docid17306 rev 2 1 characteristics table 2. absolute maximum ratings symbol characteristic value unit i fsm forward surge current (per diode) (1) 1. sinusoidal pulse of 10 ms duration 300 a v rrm repetitive peak reverse voltage (2) 2. pulsed, duration 5 ms, f = 50 hz 100 v i rrm repetitive peak reverse current (3) 3. pulsed, duration 2 s, f = 1 khz 1a i o average output rectified current (50% duty cycle): (4) , (5) per diode per device 4. for t case +132c per device and t case +148c per diode, derate linearly to 0 a at +175c. 5. the ?per device? ratings apply only when both anode terminals are tied together. 20 40 a i f(rms) forward rms current (per diode) 30 a t op operating temperature range (6) (case temperature) 6. for devices with hot solder dip lead finish all testing performed at t amb > +125 c are carried out in a 100% inert atmosphere. -65 to +175 c t j junction temperature +175 c t stg storage temperature range (6) -65 to +175 c t sol soldering temperature: for to-254 (7) 7. duration 10 seconds maximum at a distance of not less than 1.5 mm from the device body and the same lead shall not be resoldered until 3 minutes have elapsed. +260 c dv/dt critical rate of rise of reverse voltage 10000 v/s table 3. thermal resistance symbol characteristic value unit r th(j-c) (1) 1. package mounted on infinite heatsink thermal resistance, junction to case per diode per device 1.5 1.2 c/w
docid17306 rev 2 3/9 stps40100hr characteristics 9 s table 4. electrical measurements at ambiant temperature (per diode), t amb = 22 3 c symbol characteristic mil-std-750 test method test conditions values units min. max. i r1 reverse current 4016 dc method, v r = 100 v - 30 a i r2 dc method, v r = 50 v - 5 a v f1 (1) forward voltage 4011 pulse method, i f = 5 a - 610 mv v f2 (1) pulse method, i f = 10 a - 730 mv v f3 (1) pulse method, i f = 20 a - 900 mv c capacitance 4001 v r = 10 v, f = 1 mhz - 1 nf z th(j-c) (2) relative thermal impedance, junction to case 3101 i h = 15 to 40 a, t h = 50 ms i m = 50 ma, t md = 100 s calculate v f (3) c/w 1. pulse width 300s, duty cycle 2% 2. performed only during screening tests parameter drif t values (initial measurements for htrb), go-no-go. 3. the limits for vf shall be defined by the manufacturer on every lot in accordance with mil-std-750 method 3101 and shall guarantee the r th(j-c) limits specified in maximum ratings. table 5. electrical measurements at high and low temperatures (per diode) symbol characteristic mil-std-750 test method test conditions (1) values units min. max. i r1 reverse current 4016 t case = +125 (+0, -5) c dc method, v r = 100 v -20ma i r2 t case = +125 (+0, -5) c dc method, v r = 50 v -7.5ma v f2 (2) forward voltage 4011 t case = +125 (+0, -5) c pulse method, i f = 10 a - 660 mv v f3 (2) t case = +125 (+0, -5) c pulse method, i f = 20 a - 850 mv t case = -55 (+5, -0) c pulse method, i f = 20 a - 950 mv 1. read and record measurements shall be performed on a sample of 5 components with 0 failures allowed. alternatively a 100% inspection may be performed. 2. pulse width 300s, duty cycle 2%
configurations stps40100hr 4/9 docid17306 rev 2 2 configurations figure 1. available device configuration 2 1 3 stps40100c2fsy1 stps40100c2fsyhr terminal 1: terminal 2: terminal 3: anode a common cathode anode b
docid17306 rev 2 5/9 stps40100hr package information 9 3 package information in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions and product status are available at: www.st.com . ecopack ? is an st trademark. figure 2. metal flange mount package (to-254 (a) ), 3 lead dimension definitions a. the terminal identification is specif ied by the device configuration. see figure 1 for terminal connections b a c d e ?f g h ?i j k k l ?m n r1 r2 1 2 3
package information stps40100hr 6/9 docid17306 rev 2 table 6. metal flange mount package (to-254), 3-lead dimension values reference dimension in millimetres dimlension in inches min. max. min. max. a 13.59 13.84 0.535 0.545 b 13.59 13.84 0.535 0.545 c 20.07 20.32 0.790 0.800 d 6.3 6.7 0.248 0.264 e 1 3.9 0.039 0.154 ?f 3.5 3.9 0.138 0.154 g 16.89 17.4 0.665 0.685 h 6.86 bsc 0.270 bsc ?i (1) 1. 3 locations 0.89 1.14 0.035 0.045 j 3.81 bsc 0.150 bsc k 3.81 bsc 0.150 bsc l 12.95 14.5 0.510 0.571 ?m 3.05 typ. 0.120 typ. n - 0.71 - 0.028 r1 (2) 2. radius of heatsink flange corner - 4 locations -1-0.039 r2 (3) 3. radius of body corner - 4 locations 1.65 typ. 0.065
stps40100hr ordering information docid17306 rev 2 7/9 4 ordering information contact st sales office for information about the specific conditions for tape and reel packing and for products in die form. table 7. ordering information order code escc detailed specification package lead finish comment marking (1) 1. specific marking only. the full marking includes in addition: for the engineering models : st logo, date code, country of ori gin (fr). for escc flight parts: st logo, date code, country of origin (fr), esa logo, serial number of the part within the assembly lot. mass eppl packing stps40100c2fy1 - to-254 gold double die - common cathode pin 2 stps40100c2fy1 + beo 10 - strip pack STPS40100C2FYT 5106/019/01 solder dip double die - common cathode pin 2 510601901+beo -
revision history stps40100hr 8/9 docid17306 rev 2 5 revision history table 8. document revision history date revision changes 26-mar-2010 1 initial release. 19-mar-2014 2 updated table 1: device summary and table 7: ordering information .
docid17306 rev 2 9/9 stps40100hr 9 please read carefully: information in this document is provided solely in connection with st products. stmicroelectronics nv and its subsidiaries (?st ?) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described he rein at any time, without notice. all st products are sold pursuant to st?s terms and conditions of sale. purchasers are solely responsible for the choice, selection and use of the st products and services described herein, and st as sumes no liability whatsoever relating to the choice, selection or use of the st products and services described herein. no license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. i f any part of this document refers to any third party products or services it shall not be deemed a license grant by st for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoev er of such third party products or services or any intellectual property contained therein. unless otherwise set forth in st?s terms and conditions of sale st disclaims any express or implied warranty with respect to the use and/or sale of st products including without limitation implied warranties of merchantability, fitness for a particular purpose (and their equivalents under the laws of any jurisdiction), or infringement of any patent, copyright or other intellectual property right. st products are not designed or authorized for use in: (a) safety critical applications such as life supporting, active implanted devices or systems with product functional safety requirements; (b) aeronautic applications; (c) automotive applications or environments, and/or (d) aerospace applications or environments. where st products are not designed for such use, the purchaser shall use products at purchaser?s sole risk, even if st has been informed in writing of such usage, unless a product is expressly designated by st as being intended for ?automotive, automotive safety or medical? industry domains according to st product design specifications. products formally escc, qml or jan qualified are deemed suitable for use in aerospace by the corresponding governmental agency. resale of st products with provisions different from the statem ents and/or technical features set forth in this document shall immediately void any warranty granted by st for the st product or service described herein and shall not create or extend in any manner whatsoev er, any liability of st. st and the st logo are trademarks or register ed trademarks of st in various countries. information in this document supersedes and replaces all information previously supplied. the st logo is a registered trademark of stmicroelectronics. all other names are the property of their respective owners. ? 2014 stmicroelectronics - all rights reserved stmicroelectronics group of companies australia - belgium - brazil - canada - china - czech republic - finland - france - germany - hong kong - india - israel - ital y - japan - malaysia - malta - morocco - philippines - singapore - spain - swed en - switzerland - united kingdom - united states of america www.st.com
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